Vulnerabilidades do Qualcomm Snapdragon 429 Mobile Platform Firmware
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CVEs publicadas que afetam Qualcomm Snapdragon 429 Mobile Platform Firmware: 9 registro(s), com versões afetadas e correções.cpe:2.3:o:qualcomm:snapdragon_429_mobile_platform_firmware
CVE-2025-59610
Média · 6.4
CWE-367 01/06/2026
Time-of-check Time-of-use (TOCTOU) Race Condition in Camera Driver
Memory Corruption when processing IOCTL requests with mismatched API versions due to concurrent modification of user-space buffer.
CVE-2026-21385
Alta · 7.8
KEV Alta · 57 Exploit público CWE-190 02/03/2026
Qualcomm Multiple Chipsets Memory Corruption Vulnerability
Memory corruption while using alignments for memory allocation.
CVE-2025-47383
Alta · 7.2
CWE-325 02/03/2026
Missing Cryptographic Step in Data Modem
Weak configuration may lead to cryptographic issue when a VoWiFi call is triggered from UE.
CVE-2025-47333
Média · 6.6
CWE-416 07/01/2026
Use After Free in HLOS
Memory corruption while handling buffer mapping operations in the cryptographic driver.
CVE-2025-47320
Alta · 7.8
CWE-787 18/12/2025
Out-of-bounds Write in Audio
Memory corruption while processing MFC channel configuration during music playback.
CVE-2025-27074
Alta · 7.8
CWE-131 04/11/2025
Incorrect Calculation of Buffer Size in SCE-Mink
Memory corruption while processing a GP command response.
CVE-2025-27053
Alta · 7.8
CWE-131 09/10/2025
Incorrect Calculation of Buffer Size in HLOS
Memory corruption during PlayReady APP usecase while processing TA commands.
CVE-2023-33107
Alta · 7.8
KEV Alta · 55 Exploit público CWE-190 05/12/2023
Qualcomm Multiple Chipsets Integer Overflow Vulnerability
Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call.
CVE-2023-33063
Alta · 7.8
KEV Alta · 49 CWE-416 05/12/2023
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Memory corruption in DSP Services during a remote call from HLOS to DSP.