Qualcomm Sd660 Firmware vulnerabilities
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Published CVEs affecting Qualcomm Sd660 Firmware: 14 record(s), with affected versions and fixes.cpe:2.3:o:qualcomm:sd660_firmware
CVE-2025-47369
Medium · 5.5
CWE-200 Jan 7, 2026
Information Exposure in Computer Vision
Information disclosure when a weak hashed value is returned to userland code in response to a IOCTL call to obtain a session ID.
CVE-2025-47333
Medium · 6.6
CWE-416 Jan 7, 2026
Use After Free in HLOS
Memory corruption while handling buffer mapping operations in the cryptographic driver.
CVE-2025-47331
Medium · 6.1
CWE-126 Jan 7, 2026
Buffer Over-read in Video
Information disclosure while processing a firmware event.
CVE-2025-47330
Medium · 5.5
CWE-126 Jan 7, 2026
Buffer Over-read in Video
Transient DOS while parsing video packets received from the video firmware.
CVE-2025-47320
High · 7.8
CWE-787 Dec 18, 2025
Out-of-bounds Write in Audio
Memory corruption while processing MFC channel configuration during music playback.
CVE-2025-27063
High · 7.8
CWE-416 Dec 18, 2025
Use After Free in Video
Memory corruption during video playback when video session open fails with time out error.
CVE-2025-27041
Medium · 5.5
CWE-126 Oct 9, 2025
Buffer Over-read in Video
Transient DOS while processing video packets received from video firmware.
CVE-2024-43047
High · 7.8
KEV High · 49 CWE-416 Oct 7, 2024
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Memory corruption while maintaining memory maps of HLOS memory.
CVE-2023-33106
High · 7.8
KEV High · 49 CWE-119 Dec 5, 2023
Qualcomm Multiple Chipsets Use of Out-of-Range Pointer Offset Vulnerability
Memory corruption while submitting a large list of sync points in an AUX command to the IOCTL_KGSL_GPU_AUX_COMMAND.
CVE-2023-33107
High · 7.8
KEV High · 55 Public exploit CWE-190 Dec 5, 2023
Qualcomm Multiple Chipsets Integer Overflow Vulnerability
Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call.
CVE-2023-33063
High · 7.8
KEV High · 49 CWE-416 Dec 5, 2023
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Memory corruption in DSP Services during a remote call from HLOS to DSP.
CVE-2020-11261
High · 7.8
KEV High · 52 CWE-787 Jun 9, 2021
Qualcomm Multiple Chipsets Improper Input Validation Vulnerability
Memory corruption due to improper check to return error when user application requests memory allocation of a huge size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
CVE-2021-1905
High · 7.8
KEV High · 58 Public exploit CWE-416 May 7, 2021
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Possible use after free due to improper handling of memory mapping of multiple processes simultaneously. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
CVE-2021-1906
Medium · 5.5
KEV May 7, 2021
Qualcomm Multiple Chipsets Detection of Error Condition Without Action Vulnerability
Improper handling of address deregistration on failure can lead to new GPU address allocation failure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables