Qualcomm Sdx55 Firmware vulnerabilities
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Published CVEs affecting Qualcomm Sdx55 Firmware: 16 record(s), with affected versions and fixes.cpe:2.3:o:qualcomm:sdx55_firmware
CVE-2025-47339
High · 7.8
CWE-416 Jan 7, 2026
Use After Free in HLOS
Memory corruption while deinitializing a HDCP session.
CVE-2025-47333
Medium · 6.6
CWE-416 Jan 7, 2026
Use After Free in HLOS
Memory corruption while handling buffer mapping operations in the cryptographic driver.
CVE-2025-47331
Medium · 6.1
CWE-126 Jan 7, 2026
Buffer Over-read in Video
Information disclosure while processing a firmware event.
CVE-2025-47325
Medium · 5.5
CWE-822 Dec 18, 2025
Untrusted Pointer Dereference in TZ Firmware
Information disclosure while processing system calls with invalid parameters.
CVE-2025-47320
High · 7.8
CWE-787 Dec 18, 2025
Out-of-bounds Write in Audio
Memory corruption while processing MFC channel configuration during music playback.
CVE-2025-47370
Medium · 6.5
CWE-617 Nov 4, 2025
Reachable Assertion in BT Controller
Transient DOS when a remote device sends an invalid connection request during BT connectable LE scan.
CVE-2025-27074
High · 7.8
CWE-131 Nov 4, 2025
Incorrect Calculation of Buffer Size in SCE-Mink
Memory corruption while processing a GP command response.
CVE-2025-27054
High · 7.8
CWE-787 Oct 9, 2025
Out-of-bounds Write in Display
Memory corruption while processing a malformed license file during reboot.
CVE-2025-27053
High · 7.8
CWE-131 Oct 9, 2025
Incorrect Calculation of Buffer Size in HLOS
Memory corruption during PlayReady APP usecase while processing TA commands.
CVE-2025-27040
Medium · 6.5
CWE-20 Oct 9, 2025
Improper Input Validation in TZ Firmware
Information disclosure may occur while processing the hypervisor log.
CVE-2023-33107
High · 7.8
KEV High · 55 Public exploit CWE-190 Dec 5, 2023
Qualcomm Multiple Chipsets Integer Overflow Vulnerability
Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call.
CVE-2023-33063
High · 7.8
KEV High · 49 CWE-416 Dec 5, 2023
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Memory corruption in DSP Services during a remote call from HLOS to DSP.
CVE-2022-22071
High · 7.8
KEV High · 46 CWE-416 Jun 14, 2022
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
CVE-2020-11261
High · 7.8
KEV High · 52 CWE-787 Jun 9, 2021
Qualcomm Multiple Chipsets Improper Input Validation Vulnerability
Memory corruption due to improper check to return error when user application requests memory allocation of a huge size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
CVE-2021-1905
High · 7.8
KEV High · 58 Public exploit CWE-416 May 7, 2021
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Possible use after free due to improper handling of memory mapping of multiple processes simultaneously. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
CVE-2021-1906
Medium · 5.5
KEV May 7, 2021
Qualcomm Multiple Chipsets Detection of Error Condition Without Action Vulnerability
Improper handling of address deregistration on failure can lead to new GPU address allocation failure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables